HBM2E - SK Hynix/Samsung Semiconductor IC Chips

HBM2E — High Bandwidth Memory 2E for AI and high-performance computing Original stock available. Fast global shipping.

Confirm with quotation Hot Part AEC-Q100 2.5D SiP
SK Hynix/Samsung
HBM2E
Confirm with quotation
Part Number HBM2E
Manufacturer SK Hynix/Samsung
Product Category Memory
Package / Encapsulation 2.5D SiP
Status Confirm with quotation
Lead Time Confirm with quotation
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Core Specifications

Key Parameters

Operating Temperature -40°C to +85°C
Supply Voltage 1.8V - 5.5V
Package 2.5D SiP
Interface Standard
Mounting SMD
Application Type Memory
Technical Data

Full Specifications

Parameter Min Typ Max Unit
Operating Voltage1.83.35.5V
Operating Current1.83.35.5V
Package1.83.35.5V

Product Description

HBM2E — High Bandwidth Memory 2E for AI and high-performance computing Original stock available. Fast global shipping.

Key Features

  • Ultra-high bandwidth
  • Low power consumption
  • Stacked memory architecture
  • AI/ML optimized
  • High capacity per stack
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Before you confirm an order

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Use the technical information on this page as a reference and verify the complete orderable part against current manufacturer documentation. Confirm the actual batch, condition, source, documents and commercial terms before purchase.

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